Well, they only had to test it for a single hardware deployment. Windows has to be tested for millions if not billions of deployments. Say what you want, but Microsoft testers are god like.

M3 is not faster than any AMD or Intel. And PC chips are using very old process nodes. Once Intel gets to 2nm, Apple chips will feel like dumbphone SOCs from the early 2000-s running J2ME applets.

First of all, PLA is not brittle at all. I don’t understand why people use this word. Glass is brittle, PLA is not. It does have lower impact resistance than PETG, but the difference is not that big. Also, bendy part is as useful as a snapped part in every application that requires strength. Tensile strength and flexural strength is usually more important in most applications and PLA excels in those.

If impact resistance is important to you, you can try BASF PRO1 PLA, which absorbs much higher impact forces than any regular PETG.

PLA’s susceptibility to warping or bending in even fairly moderate heat

Glass transition temperature for PLA is 60C. It does NOT warp or bend at temperatures below 60C. It’s just physically impossible. But yeah, 60C is quite a low temperature for many applications. Glass transition temperature of PETG is just 81C. While it’s higher than PLA it is still not suitable for anything which can reach boiling water temps.

If both strength and temperature resistance are important, then the obvious choice is ASA. PETG’s only benefit is that you can buy certified food safe PETG filament easily and cheaply. Otherwise PETG is pretty much useless for all intents and purposes.

PETG is weaker than PLA. Actually PLA is the strongest filament.